12" wafer of CSP bumped chips, hot off the line (solder balls are face-up in this photo, with a couple die already removed for testing).
12" wafer of CSP bumped chips, hot off the line (solder balls are face-up in this photo, with a couple die already removed for testing).
Learn more on how to simulate the Baochip-1x here: baochip.github.io/baochip-1x/c...
Learn more on how to simulate the Baochip-1x here: baochip.github.io/baochip-1x/c...