TechConference

IC & Sensor Packaging Expo Japan

Name: IC & Sensor Packaging Expo Japan
Start: 2027-02-17T18:00:00+09:00
Location: Tokyo Big Sight (Tokyo International Exhibition Center)

Wed, 17 Feb 2027 at 18:00

Tokyo Big Sight (Tokyo International Exhibition Center)

3-11-1 Ariake, Koto-ku, 135-0063

有明 Open in Maps

Indoor

About

IC & Sensor Packaging Expo Japan at Tokyo Big Sight is a premier trade show for IC final manufacturing, featuring assembly equipment, packaging materials, and analytics software. Explore the latest packaging solutions, test equipment, and services from global suppliers in a focused tech expo setting.

VibeProfessional Intellectual

AudienceProfessionals

TagsIC packaging Semiconductor Electronics Tokyo Big Sight Packaging equipment Assembly equipment Materials

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