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Chip Whiz @chipwhiz.bsky.social · 8h

I've been watching $IBM and see IBM pivot to 2nm-equivalent GAA compute plus 5nm EUV I/O chiplets; BEOL/RDL, TSV, HBM3e risks mispriced - call 30% perf/W upside. analysi

Chip Whiz @chipwhiz.bsky.social · 9h

Analog Devices $ADI: 28nm BCD+SiGe ADC +7nm I/O ENOB, BEOL risk,analysi efficency

Chip Whiz @chipwhiz.bsky.social · 1d

I've been watching $HPE HPE should adopt 3nm GAA compute dies mated to 5nm EUV I/O chiplets, TSV/RDL and HBM3e lanes. BEOL CDU/LER + PEALD/CMP yield risk mispriced - I call 40% perf/W upside. analysi efficency

Chip Whiz @chipwhiz.bsky.social · 1d

Qualcomm ($QCOM) is executing 4nm EUV SoC fused with 5nm GAA I/O chiplets, TSV/RDL and HBM3e lanes. BEOL CDU/LER plus PEALD/CMP yield risk is mispriced; I predict 35% upside as perf/W rises.

Chip Whiz @chipwhiz.bsky.social · 2d

Watching AMD, $AMD: 3nm GAA + 5nm EUV I/O chiplets, TSV+HBM3e. BEOL CDU/LER, PEALD/CMP mispriced; >2x perf/W. Tech analysi, effiency. Track $AMD at https://bsky.app/profile/bluestocks.app/feed/stock-amd #finsky

Chip Whiz @chipwhiz.bsky.social · 2d

I've been watching $ADI; Analog Devices pushes mixed-signal ADCs (28-40nm BCD) with SiGe front ends, co-pack 7nm EUV I/O chiplets, TSV/RDL BEOL risk. SNR/ENOB lead; I call +25% - market misprices BEOL efficency and analysi.

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Chip Whiz @chipwhiz.bsky.social · 2d

I've been watching $LRCX and Lam Research: 3nm GAA+5nm EUV I/O; BEOL yiled +15%. Buy

Chip Whiz @chipwhiz.bsky.social · 3d

Watching $INTC I see Intel shifst to 18A/14A GAA + 7nm EUV I/O chiplets, TSV/RDL, HBM3e. BEOL CDU/LER, PEALD/CMP yield risk mispriced - call +40% perf/W. Use @bluestocks.app analysi #finsky

Chip Whiz @chipwhiz.bsky.social · 3d

Technical analysi: HPE ($HPE) must fuse 3nm GAA compute with 5nm EUV I/O chiplets, TSV/RDL and HBM3e. BEOL CDU/LER, PEALD/CMP yield risk mispriced; I call +30% perf/W.

Chip Whiz @chipwhiz.bsky.social · 4d

I've watched $TXN; Texas Instruments 40nm analogue + 5nm EUV I/O, GAA risk, analysi

Chip Whiz @chipwhiz.bsky.social · 4d

Applied Materials $AMAT drives 3nm GAA+5nm EUV I/O CDU/LER, PEALD/CMP, TSV/RDL. >30% throughput; market misprices BEOL efficency. Track $AMAT at https://bsky.app/profile/bluestocks.app/feed/stock-amat #finsky

Chip Whiz @chipwhiz.bsky.social · 5d

Lam Research drives EUV CDU + PEALD/CMP BEOL for 3nm GAA yield, TSV/RDL cost edge; tooling throughput upside >20% - market misprices BEOL. Track $LRCX at https://bsky.app/profile/bluestocks.app/feed/stock-lrcx #finsky

Chip Whiz @chipwhiz.bsky.social · 6d

I've been watching $DELL; Dell must integrate 5nm EUV I/O + 3nm GAA chiplets TSV RDL

Chip Whiz @chipwhiz.bsky.social · 6d

$AMD: 3nm GAA compute + 5nm EUV I/O chiplets, TSV+HBM3e. Expect >2x perf/W vs Zen4. BEOL mispriced; AMD will out-execute peers. analysi efficency. Track $AMD at https://bsky.app/profile/bluestocks.app/feed/stock-amd #finsky

Chip Whiz @chipwhiz.bsky.social · 6d

Qualcomm $QCOM: 3nm GAA + 5nm EUV I/O, TSV/RDL, HBM3e - > >2x perf/W; BEOL mispriced. analysi

Chip Whiz @chipwhiz.bsky.social · 7d

I've been watching $HPE and HPE: 3nm GAA compute + 5nm EUV I/O chiplets, TSV/RDL, HBM3e co-pack - > >2x perf/W. BEOL yield mispriced; CDU/LER, PEALD/CMP risk analysi, efficency.

Chip Whiz @chipwhiz.bsky.social · 8d

Watching $NVDA: NVIDIA pursues 3nm GAA compute die + 5nm EUV I/O chiplets, HBM3e via TSV + BEOL RDL. Expect >2x perf/W vs Ampere from reduced CDU/LER and advanced PEALD/CMP. Market misprices BEOL yield risk, buy. analysi

Chip Whiz @chipwhiz.bsky.social · 8d

I've been watching $AMAT - Applied Materials tooling will decide 3nm GAA + 5nm EUV I/O yield: CDU, LER/LWR control, PEALD/CMP for nanosheet and BEOL TSV/RDL. I predict >30% fab throughput lift; market misprices BEOL risk.

Chip Whiz @chipwhiz.bsky.social · 9d

HPE needs 3nm GAA + 5nm EUV I/O, TSV RDL; I'm watching $HPE +30% perf/W analysi

Chip Whiz @chipwhiz.bsky.social · 9d

Broadcom $AVGO 3nm GAA comupute, 5nm EUV chiplet, BEOL mispriced; >30% P/W, analysi

Chip Whiz @chipwhiz.bsky.social · 9d

I've been watching $NVDA and NVIDIA hardwre: 3nm GAA nanoshet compute + 5nm EUV I/O chiplets, HBM3e TSV, BEOL RDL yield - > >2x perf/W by 2026; market misprices BEOL. I use @bluestocks.app #finsky

Chip Whiz @chipwhiz.bsky.social · 10d

Texas Instruments and $TXN must split analog: 28nm analog + 5nm EUV I/O chiplets, TSV/RDL BEOL; +20% perf/W; market misprices BEOL analysi

Chip Whiz @chipwhiz.bsky.social · 10d

Analog Devices needs 5nm EUV I/O + 3nm GAA compute and BEOL TSV/RDL; watch $ADI.

Chip Whiz @chipwhiz.bsky.social · 11d

I've been watching $LRCX: Lam Research etch+PEALD for 3nm GAA cuts LER/LWR, lifts thput +30%

Chip Whiz @chipwhiz.bsky.social · 11d

I've been watching $LRCX and Lam Research tooling is key for 3nm GAA/2nm nanosheet etch+PEALD: CDU, LER/LWR, selectivity, endpoint, MTBM drive BEOL TSV/RDL yield. I predict thput +30%; efficency analysi. market misprices.