Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on PEN eBook December 2025, SiC and GaN Markets, and DC/DC Converters in BESS!

The MLX90296 contactless linear sensor combines digital flexibility, ultra low power consumption, adaptable polarity modes, and a space-saving form factor.

The new TSZ901 op-amp ensures stable, high-precision operation over the full −40°C to 125°C temperature range.

“This discovery is a new pathway toward environmentally responsible technologies that can power sensors,” says Dr. Dominik Kubicki.

Ultra-low-noise JFETs are suitable for analog front ends, discrete op amps, and low-noise amplifiers.

The SMD capacitors are offered with rated voltages ranging from 25 V to 80 V and capacitance values between 56 µF and 1100 µF.

Vishay Intertechnology Inc., a global manufacturer of passive and discrete solutions, kicked off the launch of its new MAACPAK power modules, catering to silicon carbide (SiC) MOSFETs. These offer large improvements over many industry-standard SiC modules on the market while still maintaining compatibility with existing solutions. Vishay’s improvements over its previous power module generation, EMIPAK, reduce stray inductance—a key bottleneck—significantly, allowing internal SiC MOSFETs to switch efficiently at higher frequencies; this effectively shrinks solution size.

The new wafer fab introduces advanced GaN and SiC manufacturing, positioning Malaysia to enter front-end semiconductor production for the first time.

NTT, Inc. has demonstrated amplification of high-frequency wireless signals using aluminum nitride (AlN)–based transistors. 

Wolfspeed announced Toyota will deploy its automotive-grade SiC MOSFETs to power onboard charging across its BEV lineup.

SiC and GaN stand center stage, controlling many different industries’ dynamics.

As we close out 2025, we take a closer look at advances in motor control systems impacting industries ranging from industrial automation and control to military and automotive.

In power electronics, moving to 300mm SiC wafers increases the number of devices per substrate and helps drive down the cost of each chip.

In industrial systems, many devices require a lower voltage. This is where DC/DC power modules come into play, where the power supply is reliable, efficient, and EMC-compliant.

Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Digital Power Supply Control, SiC in AC Motor Drives, and Small Fusion Reactors!

Empower announced a new corporate headquarters in Milpitas, California, and a dedicated R&D center in Munich, Germany.

WBG semiconductors are changing the way modern technology works. Materials such as GaN and SiC are changing the game in power electronics.

The newly introduced SiC MOSFETs shrink the component size by about 26% and feature an ultra-thin 2.3 mm profile.

The components provide reliable inrush current limiters performance for switch-mode supplies, frequency converters, photovoltaic inverters, UPS units, and soft-start motors.

Diodes Inc. launches programmable 5.5V/4A buck converter with I2C interface for tightly-integrated automotive point-of-load (PoL) designs.

The XP Power SiC 10-kW PSU uses a high-voltage digital control loop for on-the-fly adjustments that previously required manual intervention.

We explore the LPM-MSPM0G3519 LaunchPad development kit, a feature-rich platform built around TI’s MSPM0G3519 ARM Cortex-M0+ microcontroller.

SemiQ expands 1200 V QSiC Gen3 portfolio with six-pack B2, full-bridge B3, and half-bridge S3 power modules.

While silicon IGBTs remain dominant in AC motor drives, the performance and cost improvements from SiC make a compelling case for evaluating the overall system benefits.

The new AEM15820 PMIC supports energy harvesting from lighting conditions ranging from indoor illumination to full outdoor sunlight.