Semiconductor Engineering
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Deep insights for the chip industry. semiengineering.com Hot topics: semiconductor, EDA, advanced packaging, hardware, low power, HPC, hardware security, automotive chips, embedded, edge computing, semiconductor manufacturing, chip design, VLSI
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New technical papers recently added to Semiconductor Engineering’s library
semiengineering.com/chip-industr...

#semiconductor
semiengineering.bsky.social
SemiEngineering has over 500 Tech Talk videos to learn from.
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Hot topics included challenges involving chiplets/ heterogeneous integration, AI, data management, DRAM, manufacturing and test & much more. Let us know what other topics are of interest.

#semiconductor
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Location verification is gaining traction as a way of strengthening supply chain oversight with minimal effort, fueled by tightening export controls & growing concerns about AI chip smuggling & counterfeiting
semiengineering.com/location-ver...

#locationverification #semiconductor #locationtracking
Location Verification Becomes Much Bigger Concern For Chips
Mature methods can show where a chip is shipped, and even restrict where it is being used.
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How 3D-IC Will Change Chip Design:
Stacking dies will dramatically improve performance, but it’s still a work in progress.
Final in 3 part series with 5 experts
semiengineering.com/how-3d-ic-wi...

#3DIC #semiconductor #chiplets
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Startup Funding: Q3 2025:
The third quarter was dominated by massive rounds, with 75 companies raising $6 billion.
semiengineering.com/startup-fund...
#semiconductor #startups #AI #photonics #quantum #AIhardware
Startup Funding: Q3 2025
Blowout quarter for AI and quantum; 75 companies raise $6 billion.
semiengineering.com
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The chip industry traditionally has relied on margins to help them mitigate timing problems, but an increasing array of factors are now influencing timing. Can static timing analysis evolve to address these problems?
semiengineering.com/the-demise-o...

#verification #EDA #semiconductor
The Demise Of Static Timing Verification?
Timing is increasingly dependent on vectors. Can static techniques continue to deliver the necessary results? Maybe.
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6G is expected to bring data speeds that enable highly integrated and responsive technology in smartphones, homes, cities, and autonomous vehicles, but realizing that goal will require a lot more work.
semiengineering.com/new-antennas...
#6G
New Antennas And Advanced ICs Needed For 6G
Higher frequencies bring more complexity to every part of the network, from tiny antennas to powerful base station processors.
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The complexity of connecting different layers to create high-fidelity models, what those layers need to include, and why standards are needed to maximize their benefits and simplify their creation. With David Fried, VP at Lam Research
youtu.be/2ulbbpB-1W4?...

#semiconductor #virtualtwins
Virtual Twins
YouTube video by Semiconductor Engineering
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New technical papers recently added to Semiconductor Engineering’s library:
semiengineering.com/chip-industr...

#semiconductor #DRAM #SRAM #EDA #MRAM #cybersecurity
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A growing number of AI processors are being designed around specific workloads rather than standardized benchmarks, optimizing performance and power efficiency, but often with enough flexibility to adapt to future changes. semiengineering.com/balancing-wo...

#processors #AIworkloads #GPU #NPU #CPU
Balancing Workloads In AI Processor Designs
Optimization and architecture definition are important, but there's a downside to too much customization.
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Limitations of supervised FDC, which relies on previous faults, and why unsupervised FDC is necessary to reduce scrap and predict where failures will occur. This is the third part in a seven-part series on AI in manufacturing.
semiengineering.com/using-ai-for...
Using AI For Fault Detection And Classification In Manufacturing
Supervised vs. unsupervised FDC and its impact on yield.
semiengineering.com
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Changes are coming as DRAM is called upon to store & retrieve more data faster. This Tech Talk looks at how DRAM works, the impact of cooling new solutions in denser configurations, & ongoing issues involving the security of data.

semiengineering.com/the-evolutio...
#DRAM #HBM #LPDDR #GDDR
The Evolution of DRAM
How and why this tried-and-true memory is changing.
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Chip Industry Technical Paper Roundup:
New technical papers recently added to Semiconductor Engineering’s library
semiengineering.com/chip-industr...

#semiconductor
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Special Report: Governments & systems companies are changing the rules around semiconductor security, forcing chipmakers and their suppliers to comply with tough new regulations that require resiliency in hardware.
semiengineering.com/security-req...

#semiconductor #cybersecurity #hardwaresecurity
Security Requirements And Penalties Grow For Chipmakers
Cost of designing chips and IP will increase, and companies at fault for breaches will be liable for damages.
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Challenges In Stacking HBM:
What changes are needed to stack 24 layers of high-bandwidth memory.
semiengineering.com/challenges-i...

#HBM #hybridbonding #warpage #metrology #datacenter
Challenges In Stacking HBM
What changes are needed to stack 24 layers of high-bandwidth memory.
semiengineering.com
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Part average testing, one of the mainstays of semiconductor test, is becoming much more challenging at advanced nodes and in multi-die assemblies.
semiengineering.com/advanced-par...

#semiconductor
Advanced Part Average Testing For Chips
Unique designs and multi-die assemblies are forcing innovations at the leading edge of testing.
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