Semiconductor Engineering
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Deep insights for the chip industry.
semiengineering.com
Hot topics: semiconductor, EDA, advanced packaging, hardware, low power, HPC, hardware security, automotive chips, embedded, edge computing, semiconductor manufacturing, chip design, VLSI
semiengineering.com
Hot topics: semiconductor, EDA, advanced packaging, hardware, low power, HPC, hardware security, automotive chips, embedded, edge computing, semiconductor manufacturing, chip design, VLSI
Latest Semiconductor Engineering newsletter:
Manufacturing, Packaging and Materials semiengineering.com/newsletter/m...
#semiconductor #semiconductormanufacturing
Manufacturing, Packaging and Materials semiengineering.com/newsletter/m...
#semiconductor #semiconductormanufacturing
January 28, 2026 at 4:38 PM
Latest Semiconductor Engineering newsletter:
Manufacturing, Packaging and Materials semiengineering.com/newsletter/m...
#semiconductor #semiconductormanufacturing
Manufacturing, Packaging and Materials semiengineering.com/newsletter/m...
#semiconductor #semiconductormanufacturing
For decades, electronics offered 2 levels of routing structure to manage signals that originate or terminate in an IC. Recently, that number has risen to 5, bringing greater complexity and design decisions
semiengineering.com/an-explosion...
#interconnects #semiconductor
semiengineering.com/an-explosion...
#interconnects #semiconductor
An Explosion In Interconnect Complexity
The chip industry has gone from two routing platforms to five. That's a lot.
semiengineering.com
January 26, 2026 at 4:38 PM
For decades, electronics offered 2 levels of routing structure to manage signals that originate or terminate in an IC. Recently, that number has risen to 5, bringing greater complexity and design decisions
semiengineering.com/an-explosion...
#interconnects #semiconductor
semiengineering.com/an-explosion...
#interconnects #semiconductor
Reposted by Semiconductor Engineering
New approaches and research surge in the face of DRAM shortages and SRAM scaling limitations.
semiengineering.com/oxides-bring...
semiengineering.com/oxides-bring...
Oxides Bring Low Leakage Transistors To Leading-Edge Memories
New approaches and research surge in the face of DRAM shortages and SRAM scaling limitations.
semiengineering.com
January 24, 2026 at 6:19 PM
New approaches and research surge in the face of DRAM shortages and SRAM scaling limitations.
semiengineering.com/oxides-bring...
semiengineering.com/oxides-bring...
Semiconductor progress often is described as a story of shrinking transistors. Increasingly, it is becoming a story of the materials between them.
semiengineering.com/every-atom-n...
#semiconductor
semiengineering.com/every-atom-n...
#semiconductor
Every Atom Now Counts In Advanced Chip Manufacturing
How atomic-layer deposition and hybrid dielectrics are redefining reliability and scaling for AI-era semiconductors.
semiengineering.com
January 22, 2026 at 4:25 PM
Semiconductor progress often is described as a story of shrinking transistors. Increasingly, it is becoming a story of the materials between them.
semiengineering.com/every-atom-n...
#semiconductor
semiengineering.com/every-atom-n...
#semiconductor
John Kibarian, CEO of PDF Solutions, talks with SE’s Ed Sperling about the growing role of AI in chip manufacturing, the impact of 3D-ICs on the supply chain, and how to shorten cycle time to get leading-edge chips and multi-die assemblies to market more quickly.
semiengineering.com/big-changes-...
semiengineering.com/big-changes-...
Big Changes Ahead For Semiconductor Manufacturing
Inside Chips Podcast: PDF Solutions' CEO discusses AI in chip manufacturing, 3D-ICs, and shorter cycle times.
semiengineering.com
January 21, 2026 at 4:31 PM
John Kibarian, CEO of PDF Solutions, talks with SE’s Ed Sperling about the growing role of AI in chip manufacturing, the impact of 3D-ICs on the supply chain, and how to shorten cycle time to get leading-edge chips and multi-die assemblies to market more quickly.
semiengineering.com/big-changes-...
semiengineering.com/big-changes-...
Always an interesting quarterly report to peruse. Here's where the investments are going. Don't miss the chart at the end semiengineering.com/startup-fund...
#semiconductor
#semiconductor
Startup Funding: Q4 2025
More and bigger funding rounds for AI chips and AI for making chips; 75 companies raise $3 billion.
semiengineering.com
January 19, 2026 at 4:40 PM
Always an interesting quarterly report to peruse. Here's where the investments are going. Don't miss the chart at the end semiengineering.com/startup-fund...
#semiconductor
#semiconductor
AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge devices such as PCs and smartphones.
6 experts discuss how and why to optimize NPUs.
semiengineering.com/how-and-why-...
#NPU
6 experts discuss how and why to optimize NPUs.
semiengineering.com/how-and-why-...
#NPU
How And Why To Optimize NPUs
PPA constraints need to be paired with real workloads, but they also need to be flexible to account for future changes.
semiengineering.com
January 18, 2026 at 5:41 PM
AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge devices such as PCs and smartphones.
6 experts discuss how and why to optimize NPUs.
semiengineering.com/how-and-why-...
#NPU
6 experts discuss how and why to optimize NPUs.
semiengineering.com/how-and-why-...
#NPU
With the rise in AI, data-center power density has grown to the point where liquid cooling is now seeing a larger buildout. Single-phase cooling predominates currently, but 2-phase & immersion cooling are also growing as options.
semiengineering.com/liquid-cooli...
#datacenters #cooling #AI
semiengineering.com/liquid-cooli...
#datacenters #cooling #AI
Liquid Cooling Gains Traction In Data Centers
There are numerous ways to remove heat from chips, and more are on the way.
semiengineering.com
January 15, 2026 at 5:05 PM
With the rise in AI, data-center power density has grown to the point where liquid cooling is now seeing a larger buildout. Single-phase cooling predominates currently, but 2-phase & immersion cooling are also growing as options.
semiengineering.com/liquid-cooli...
#datacenters #cooling #AI
semiengineering.com/liquid-cooli...
#datacenters #cooling #AI
Data sharing is becoming critical at leading device nodes, where process variability is starting to consume ever-greater portions of the process margin.
semiengineering.com/secure-data-...
#semiconductor
semiengineering.com/secure-data-...
#semiconductor
Secure Data Sharing Becoming Critical For Chip Manufacturing
Driven by a plethora of benefits, data sharing is gradually becoming a “must have” for advanced device nodes and multi-die assemblies.
semiengineering.com
January 14, 2026 at 4:50 PM
Data sharing is becoming critical at leading device nodes, where process variability is starting to consume ever-greater portions of the process margin.
semiengineering.com/secure-data-...
#semiconductor
semiengineering.com/secure-data-...
#semiconductor
In today’s AI-class devices, wafer probe has become one of the most mechanically aggressive and least forgiving steps in the entire flow. semiengineering.com/wafer-probe-...
#semiconductor
#semiconductor
Wafer Probe Struggles To Adapt To Multi-Die Assemblies
Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.
semiengineering.com
January 13, 2026 at 4:37 PM
In today’s AI-class devices, wafer probe has become one of the most mechanically aggressive and least forgiving steps in the entire flow. semiengineering.com/wafer-probe-...
#semiconductor
#semiconductor
New technical papers recently added to Semiconductor Engineering’s library:
semiengineering.com/chip-industr...
#semiconductor
semiengineering.com/chip-industr...
#semiconductor
January 11, 2026 at 5:06 PM
New technical papers recently added to Semiconductor Engineering’s library:
semiengineering.com/chip-industr...
#semiconductor
semiengineering.com/chip-industr...
#semiconductor
“This is one of the problems of taking a design and disaggregating all the components into a set of heterogeneous chiplets”
semiengineering.com/is-end-to-en...
#semiconductor #hardwaresecurity #advancedpackaging
semiengineering.com/is-end-to-en...
#semiconductor #hardwaresecurity #advancedpackaging
Is End-To-End Security Possible?
New regulations make this non-negotiable, but multi-die assemblies and more interactions at the edge are creating some huge hurdles.
semiengineering.com
January 8, 2026 at 4:18 PM
“This is one of the problems of taking a design and disaggregating all the components into a set of heterogeneous chiplets”
semiengineering.com/is-end-to-en...
#semiconductor #hardwaresecurity #advancedpackaging
semiengineering.com/is-end-to-en...
#semiconductor #hardwaresecurity #advancedpackaging
Special Report: Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D. Don't miss the table at the end
semiengineering.com/annual-globa...
#semiconductor #fabs
semiengineering.com/annual-globa...
#semiconductor #fabs
Annual Global IC Fabs And Facilities Report
Companies and governments invested heavily in onshoring fabs and facilities over the past 12 months as tariffs threatened to upset the global supply chain.
semiengineering.com
January 7, 2026 at 4:21 PM
Special Report: Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D. Don't miss the table at the end
semiengineering.com/annual-globa...
#semiconductor #fabs
semiengineering.com/annual-globa...
#semiconductor #fabs
Increased storage needs at the edge and in the cloud are fueling rising demand for higher-capacity flash memory across multiple applications.
semiengineering.com/cryogenic-et...
#3DNAND #FlashMemory #CryogenicEtch #semiconductor
semiengineering.com/cryogenic-et...
#3DNAND #FlashMemory #CryogenicEtch #semiconductor
Cryogenic Etch: A Key Enabler Of 3D NAND
Next-gen 3D NAND depends on the performance and repeatability of cryogenic etching processes
semiengineering.com
January 6, 2026 at 4:33 PM
Increased storage needs at the edge and in the cloud are fueling rising demand for higher-capacity flash memory across multiple applications.
semiengineering.com/cryogenic-et...
#3DNAND #FlashMemory #CryogenicEtch #semiconductor
semiengineering.com/cryogenic-et...
#3DNAND #FlashMemory #CryogenicEtch #semiconductor
You may find Semiconductor Engineering's Events page useful for planning your attendance at the best chip industry conferences in 2026. Good one to bookmark.
semiengineering.com/semiconducto...
#semiconductor
semiengineering.com/semiconducto...
#semiconductor
January 4, 2026 at 7:04 PM
You may find Semiconductor Engineering's Events page useful for planning your attendance at the best chip industry conferences in 2026. Good one to bookmark.
semiengineering.com/semiconducto...
#semiconductor
semiengineering.com/semiconducto...
#semiconductor
Reposted by Semiconductor Engineering
Semiconductor Engineering gathered a group of 6 experts to discuss why some AI workloads are better suited for on-device processing to achieve consistent performance, avoid network connectivity issues, reduce cloud computing costs, and ensure privacy.
semiengineering.com/ai-workloads...
#Edge
semiengineering.com/ai-workloads...
#Edge
AI Workloads at the Edge: Ensuring Performance, Privacy, and Security
There are challenges and solutions for processing AI workloads on-device to achieve consistent performance, reduce costs, and enhance data privacy and security.
semiengineering.com
December 22, 2025 at 4:13 PM
Semiconductor Engineering gathered a group of 6 experts to discuss why some AI workloads are better suited for on-device processing to achieve consistent performance, avoid network connectivity issues, reduce cloud computing costs, and ensure privacy.
semiengineering.com/ai-workloads...
#Edge
semiengineering.com/ai-workloads...
#Edge
